华虹半导体2022年年度报告

HUAHONGSEMICONDUCTORLIMITED 华虹半导体有限公司 (IncorporatedinHongKongwithlimitedliability) （于香港注册成立之有限公司） (StockCode:1347) 2022 （股份代号：1347） 年度报告ANNUALREPORT 华彩未来 芯 EmpoweringtheInformationAge CONTENTS Definitions2 KeyFinancials6 LettertoShareholders7 CorporateInformation9 DirectorsandSeniorManagementTeam12 CorporateGovernanceReport19 Directors’Report29 2022Environmental,SocialandGovernanceReport59 IndependentAuditor’sReport221 ConsolidatedStatementofProfitorLoss229 ConsolidatedStatementofComprehensiveIncome230 ConsolidatedStatementofFinancialPosition231 ConsolidatedStatementofChangesinEquity233 ConsolidatedStatementofCashFlows235 NotestoFinancialStatements237 华彩未来 芯 FiveYearFinancialSummary348 EmpoweringtheInformationAge 2HUAHONGSEMICONDUCTORLIMITED华虹半导体有限公司●2022ANNUALREPORT2022年度报告 DEFINITIONS Inthisannualreport,unlessotherwiserequiredbythecontext,thefollowingtermsshallhavethemeaningssetoutbelow. “AnnualGeneralMeeting”or“AGM” anannualgeneralmeetingoftheCompanytobeheldon11May2023; “AuditCommittee”theauditcommitteeoftheBoard; “Board”theBoardofDirectorsoftheCompany; “ChinaICFund”ChinaIntegratedCircuitIndustryInvestmentFundCo.,Ltd.*(国家集成电路产业投资基金股份有限公司),acompanyincorporatedinthePRCon26September2014;itsshareholdersincludetheMinistryofFinance,theenterprisesintheIntegratedCircuitIndustryCluster,large-scalestate-ownedenterprises,certainfinancialinstitutionsandprivateenterprises.Itmainlyfocusesonthemanufacturingofsemiconductorwafersandtakesintoaccounttheupstreamanddownstreamlinkscoveringchipdesign,packagetest,equipmentandmaterialsetc; “ChinaICFundII”ChinaIntegratedCircuitIndustryInvestmentFund(PhaseII)Co.,Ltd.*(国家集成电路产业投资基金二期股份有限公司),acompanyestablishedinthePRCon22October2019;itsshareholdersincludetheMinistryofFinance,theenterprisesintheIntegratedCircuitIndustryCluster,large-scalestate-ownedenterprises,certainfinancialinstitutionsandprivateenterprises.Itmainlyinvestsinthevaluechainofintegratedcircuitindustryviaequityinvestment,primarilyinintegratedcircuitchipmanufacturingaswellaschipdesigning,packagingtestandequipmentandmaterials.TothebestoftheDirectors’knowledge,informationandbeliefandhavingmadeallreasonableenquiry,ChinaICFundIIisnotanassociateofChinaICFundunderChapter14AoftheListingRules; “China”or“thePRC”thePeople’sRepublicofChina,butforthepurposeofthisannualreportandforgeographicalreferenceonlyandexceptwhereotherwiserequiredbythecontext,referencesinthisannualreportto“China”andthe“PRC”donotincludeTaiwan,theMacauSpecialAdministrativeRegionandHongKong; “Company”or“ourCompany”HuaHongSemiconductorLimited,acompanyincorporatedinHongKongwithlimitedliabilityon21January2005and,exceptwhereotherwiserequiredbythecontext,allofitssubsidiaries,oritspresentsubsidiarieswherethecontextreferstothetimebeforeitbecametheholdingcompanyofitspresentsubsidiaries; “CompanySecretary”theCompanySecretaryoftheCompany;“Director(s)”theDirector(s)oftheCompany; “EPS”earningspershare; “ExecutiveDirector(s)”theExecutiveDirector(s)ofourCompany; “ExtraordinaryGeneralMeeting”or“EGM” anextraordinarygeneralmeetingoftheCompany; “GDP”grossdomesticproduct; 2022年度报告ANNUALREPORT2022●华虹半导体有限公司HUAHONGSEMICONDUCTORLIMITED3 DEFINITIONS “GraceCayman”GraceSemiconductorManufacturingCorporation,anexemptedcompanywithlimitedliabilityincorporatedintheCaymanIslandson5October1999andawholly-ownedsubsidiaryofourCompany; “GraceShanghai”ShanghaiGraceSemiconductorManufacturingCorporation(上海宏力半导体制造有限公司),acompanyincorporatedinthePRCon20December2000andawholly-ownedsubsidiaryofourCompany.Itwasderegisteredon3August2018; “Group”ourCompanyandoursubsidiariesor,whererequiredbythecontext,withrespecttotheperiodbeforeourCompanybecametheholdingcompanyofourpresentsubsidiaries(orbecamesuchassociatedcompaniesofourCompany),thebusinessoperatedbysuchsubsidiariesortheirpredecessors(asthecasemaybe); “HHGrace”ShanghaiHuahongGraceSemiconductorManufacturingCorporation(上海华虹宏力半导体制造有限公司),acompanyincorporatedinthePRCon24January2013andawholly-ownedsubsidiaryofourCompany; “HHNEC”ShanghaiHuaHongNECElectronicsCo.,Ltd.(上海华虹NEC电子有限公司),acompanyincorporatedinthePRCon17July1997andawholly-ownedsubsidiaryofourCompany.Itwasderegisteredon3August2018; “HK$”HongKongdollars,thelawfulcurrencyofHongKong; “Hongri”ShanghaiHuahongHongriElectronicsCo.,Ltd.(上海华虹虹日电子有限公司),previouslyknownasShanghaiHongriInternationalElectronicsCo.,Ltd.until16December2021,acompanyownedasto51%byHuahongGroupandaconnectedpersonoftheCompany; “HongKong”theHongKongSpecialAdministrativeRegionofthePRC; “HuahongGroup”ShanghaiHuahong(Group)Co.,Ltd.(上海华虹（集团）有限公司),acompanyincorporatedinthePRCon9April1996asShanghaiHuaHongMicroelectronicsCo.,Ltd.andrenamedasShanghaiHuahong(Group)Co.,Ltd.in1998,andasignificantshareholderofourCompany; “HuahongGroupFrameworkAgreement” theframeworkagreementdated31December2021enteredintobetweentheCompanyandHuahongGrouptoregulatethesalesandpurchasetransactionsandprovisionofservicesbetweentheGroupandHuahongGroup,itssubsidiariesorassociates(asdefinedunderChapter14AoftheListingRules)fortheyearending31December2022; “HuahongRealEstate”ShanghaiHu