华虹半导体2023年年度报告

HUAHONGSEMICONDUCTORLIMITED 华虹半导体有限公司 (IncorporatedinHongKongwithlimitedliability) （于香港注册成立之有限公司） (StockCode:01347) （股份代号：01347） 2023 年度报告 ANNUALREPORT CONTENTS Definitions2 KeyFinancials7 LettertoShareholders8 CorporateInformation10 DirectorsandSeniorManagementTeam13 CorporateGovernanceReport23 Directors’Report35 2023Environmental,SocialandGovernanceReport68 IndependentAuditor’sReport271 ConsolidatedStatementofProfitorLoss279 ConsolidatedStatementofComprehensiveIncome280 ConsolidatedStatementofFinancialPosition281 ConsolidatedStatementofChangesinEquity283 ConsolidatedStatementofCashFlows285 NotestoFinancialStatements287 FiveYearFinancialSummary392 2HUAHONGSEMICONDUCTORLIMITED●2023ANNUALREPORT DEFINITIONS Inthisannualreport,unlessotherwiserequiredbythecontext,thefollowingtermsshallhavethemeaningssetoutbelow. “AnnualGeneralMeeting”or“AGM” anannualgeneralmeetingoftheCompanytobeheldon9May2024; “Articles”thearticlesofassociationoftheCompany(asamendedfromtimetotime); “AuditCommittee”theauditcommitteeoftheBoard; “Board”theBoardofDirectorsoftheCompany; “ChinaICFund”ChinaIntegratedCircuitIndustryInvestmentFundCo.,Ltd.*(国家集成电路产业投资基金股份有限公司),acompanyincorporatedinthePRCon26September2014;itsshareholdersincludetheMinistryofFinance,theenterprisesintheIntegratedCircuitIndustryCluster,large-scalestate-ownedenterprises,certainfinancialinstitutionsandprivateenterprises.Itmainlyfocusesonthemanufacturingofsemiconductorwafersandtakesintoaccounttheupstreamanddownstreamlinkscoveringchipdesign,packagetest,equipmentandmaterialsetc; “ChinaICFundII”ChinaIntegratedCircuitIndustryInvestmentFund(PhaseII)Co.,Ltd.*(国家集成电路产业投资基金二期股份有限公司),acompanyestablishedinthePRCon22October2019;itsshareholdersincludetheMinistryofFinance,theenterprisesintheIntegratedCircuitIndustryCluster,large-scalestate-ownedenterprises,certainfinancialinstitutionsandprivateenterprises.Itmainlyinvestsinthevaluechainoftheintegratedcircuitindustryviaequityinvestment,primarilyinintegratedcircuitchipmanufacturingaswellaschipdesigning,packagingtestandequipmentandmaterials.TothebestoftheDirectors’knowledge,informationandbeliefandhavingmadeallreasonableenquiry,ChinaICFundIIisnotanassociateofChinaICFundunderChapter14AoftheListingRules; “China”or“thePRC”thePeople’sRepublicofChina,butforthepurposeofthisannualreportandforgeographicalreferenceonlyandexceptwhereotherwiserequiredbythecontext,referencesinthisannualreportto“China”andthe“PRC”donotincludeTaiwan,theMacauSpecialAdministrativeRegionandHongKongSpecialAdministrativeRegion; “Company”or “HuaHongSemiconductor” HuaHongSemiconductorLimited,acompanyincorporatedinHongKongwithlimitedliabilityon21January2005and,exceptwhereotherwiserequiredbythecontext,allofitssubsidiaries,oritspresentsubsidiarieswherethecontextreferstothetimebeforeitbecametheholdingcompanyofitspresentsubsidiaries; “CompanySecretary”theCompanySecretaryoftheCompany;“Director(s)”theDirector(s)oftheCompany; 2023ANNUALREPORT●HUAHONGSEMICONDUCTORLIMITED3 DEFINITIONS “EPS”earningspershare; “ExecutiveDirector(s)”theExecutiveDirector(s)ofourCompany; “ExtraordinaryGeneralMeeting”or“EGM” anextraordinarygeneralmeetingoftheCompany; “GDP”grossdomesticproduct; “GraceCayman”GraceSemiconductorManufacturingCorporation,anexemptedcompanywithlimitedliabilityincorporatedintheCaymanIslandson5October1999andawholly –ownedsubsidiaryofourCompany; “GraceShanghai”ShanghaiGraceSemiconductorManufacturingCorporation(上海宏力半导体制造有限公司),acompanyincorporatedinthePRCon20December2000andawholly–ownedsubsidiaryofourCompany.Itwasderegisteredon3August2018; “Group”ourCompanyandoursubsidiariesor,whererequiredbythecontext,withrespecttotheperiodbeforeourCompanybecametheholdingcompanyofourpresentsubsidiaries(orbecamesuchassociatedcompaniesofourCompany),thebusinessoperatedbysuchsubsidiariesortheirpredecessors(asthecasemaybe); “HHGrace”ShanghaiHuahongGraceSemiconductorManufacturingCorporation(上海华虹宏力半导体制造有限公司),acompanyincorporatedinthePRCon24January2013andawholly-ownedsubsidiaryofourCompany; “HHNEC”ShanghaiHuaHongNECElectronicsCo.,Ltd.(上海华虹NEC电子有限公司),acompanyincorporatedinthePRCon17July1997andawholly-ownedsubsidiaryofourCompany.Itwasderegisteredon3August2018; “HK$”HongKongdollars,thelawfulcurrencyofHongKong; “HongKong”theHongKongSpecialAdministrativeRegionofthePRC;“HongKongStockExchange”TheStockExchangeofHongKongLimited; 4HUAHONGSEMICONDUCTORLIMITED●2023ANNUALREPORT DEFINITIONS “HuahongGroup”ShanghaiHuahong(Group)Co.,Ltd.(上海华虹（集团）有限公司),acompanyincorporatedinthePRCon9April1996asShanghaiHuaHongMicroelectronicsCo.,Ltd.andrenamedasShanghaiHuahong(Group)Co.,Ltd.in1998,andasignificantshareholderofourCompany; “HuahongGroupFrameworkAgreement” theframeworkagreementdated30December2022enteredintobetweentheCompanyandHuahongGrouptoregulatethesalesandpurchasetransactionsandprovisionofservicesbetweentheGroupandHuahongGroup,itssubsidiariesorassociates(asdefinedunderChapter14AoftheListingRules)fortheyearending31December2023; “HuahongRealEstate”ShanghaiHuahongRealEstateCo.,Ltd.(上海华虹置业有限公司),acompanyincorporatedinthePRCon28October2011anda